| 发明名称 |
CMP slurry composition for forming metal wiring line |
| 摘要 |
Disclosed is CMP slurry, which includes a pyridine-based compound including at least two pyridinyl groups, and minimizes the occurrence of dishing and erosion of a wiring line. |
| 申请公布号 |
US8137580(B2) |
申请公布日期 |
2012.03.20 |
| 申请号 |
US20070448594 |
申请日期 |
2007.12.28 |
| 申请人 |
SHIN DONG-MOK;CHOI EUN-MI;CHO SEUNG-BEOM;HA HYUN-CHUL;LG CHEM, LTD. |
发明人 |
SHIN DONG-MOK;CHOI EUN-MI;CHO SEUNG-BEOM;HA HYUN-CHUL |
| 分类号 |
C09K13/00 |
主分类号 |
C09K13/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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