发明名称 |
Printed wiring board and method for manufacturing printed wiring board |
摘要 |
A printed wiring board and a method for manufacturing the printed wiring board in which widths of a first and a second circuit are close to each other and substantial miniaturization can be achieved. In order to achieve this object, a first circuit and a second circuit having different thicknesses are formed in the same reference plane by etching a metal-clad laminate including a conductive layer and an insulating layer. The thicker of the circuits has a clad-like configuration in which three layers, a first copper layer/a different kind of metal layer/a second copper layer, are sequentially stacked. The manufacture of the printed wiring board includes a clad composite material in which three layers of a first copper layer/a different kind of metal layer/a second copper layer are sequentially stacked as a start material, and selective etching characteristics between the layers are utilized. |
申请公布号 |
US8138423(B2) |
申请公布日期 |
2012.03.20 |
申请号 |
US20050719803 |
申请日期 |
2005.11.18 |
申请人 |
WATANABE MITSUHIRO;SAIJO KINJI;OHSAWA SHINJI;YOSHIDA KAZUO;NANBU KOJI;TOYO KOHAN CO., LTD. |
发明人 |
WATANABE MITSUHIRO;SAIJO KINJI;OHSAWA SHINJI;YOSHIDA KAZUO;NANBU KOJI |
分类号 |
H05K1/03 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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