Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package

摘要

The waveform signals of ultrasonic waves reflected by a plurality of interfaces in a measurement object are received, the waveform signal of a reflected wave on a reference interface inside the measurement object is detected based on the amplitudes of the received waveform signals, and evaluation is made on the bonded condition of an interface to be measured based on the waveform signal of the reflected wave on the reference interface.