| 摘要 |
PURPOSE: An LED lighting device and manufacturing method thereof are provided to reduce manufacturing cost without a PCB substrate. CONSTITUTION: A long groove is formed in a heat sink in one direction. A wire portion(20) is inserted into the groove of the heat sink. The wiring portion includes a conductor and an insulating material in the conductor. An LED package(30) receives a power source through the wire portion. An adhesive layer is formed between the groove and the wire portion.
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