发明名称 |
Printed circuit board with conductive ink/paste, having plating layers, and method for manufacturing the same |
摘要 |
A Printed Circuit Board (PCB) and a method for manufacturing the same are provided. A circuit pattern is formed by printing conductive ink/paste on a substrate, and sintering a layer of the conductive ink or curing a layer of the conductive paste by applying heat. A primary plating layer is formed through electroless plating or electrolytic plating of a high-melting point metal on the circuit pattern. A secondary plating layer is formed through electroless plating or electrolytic plating of a precious metal on the primary plating layer to improve wetting with solder. |
申请公布号 |
US8138422(B2) |
申请公布日期 |
2012.03.20 |
申请号 |
US20090512588 |
申请日期 |
2009.07.30 |
申请人 |
PARK SE-HO;KIM KI-HYUN;KANG SEOK-MYONG;LEE YOUNG-MIN;SAMSUNG ELECTRONICS CO., LTD |
发明人 |
PARK SE-HO;KIM KI-HYUN;KANG SEOK-MYONG;LEE YOUNG-MIN |
分类号 |
H05K1/00;H05K1/03;H05K1/09 |
主分类号 |
H05K1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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