BY-PRODUCT MITIGATION IN THROUGH-SILICON-VIA PLATING

摘要

PURPOSE: A by-product mitigation in through-silicon-via plating is provided to stabilize a plating liquid through the minimum of the by-product of an accelerating agent which is generated from the accelerating agent and oxygen. CONSTITUTION: The oxygen content of the plating liquid diminishes(102). A wafer substrate is touched with a plating liquid within a plating cell(104). The oxygen content of the plating liquid within the plating cell is less than 1 ppm The plating liquid comprises an accelerating agent less than about 5 ppm. A metal is electroplated on the wafer substrate within the plating cell(106).