| 摘要 |
<p>A composition for forming a low dielectric thin film, which includes a silane polymer, polymer nanoparticles, a porogen and an organic solvent, and a method of preparing a low dielectric thin film using the same. The low dielectric thin film prepared using the composition of this disclosure has a low dielectric constant and excellent mechanical strength. As well, the polymer nanoparticles in the low dielectric thin film have a uniform diameter and are soft, and thus are advantageously applied to a chemical-mechanical polishing process.</p> |
