| 摘要 |
PURPOSE: A nozzle device for a reflow soldering apparatus is provided to implement smooth soldering by uniformly supplying hot air to all faces of a PCB(Printed Circuit Board). CONSTITUTION: A nozzle device for a reflow soldering apparatus comprises a heating chamber(30), a blow chamber(40), and a hot air supply unit. The heating chamber is arranged adjacent to a progressing path(11) passing through the center of an oven(10) and creates hot air by heating air through a heater(31). The blow chamber draws hot air of the heating chamber through a blower fan(41) and supplies the hot air to a PCB(p) transferred through the progressing path. The hot air supply unit evenly supplies hot air of the heating chamber to the PCB. One end of the hot air supply unit is communicated with the blow chamber while the other end surrounds the upper, lower, right, and left sides of the progressing path. Through holes(51,61a) are formed on the interior of the hot air supply unit facing the progressing path.
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