发明名称 NEW PHOSPHORUS ATOM-CONTAINING PHENOL RESIN AND METHOD FOR PRODUCING THE SAME, CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF, RESIN COMPOSITION FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, RESIN COMPOSITION FOR FLEXIBLE WIRING BOARD, RESIN COMPOSITION FOR SEMICONDUCTOR SEALING MATERIAL, AND RESIN COMPOSITION FOR INTERLAYER INSULATING MATERIAL FOR BUILDUP SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide flame retardancy, heat resistance and a low linear expansion coefficient to a cured product. <P>SOLUTION: A new phosphorus atom-containing phenol resin having as a main skeleton a triazine ring-containing phenol resin structure obtained by reacting an amino group-containing triazine compound, a phenol compound and an aldehyde, and having a specific structural moiety as a substituent on the aromatic nucleus is used as a curing agent for an epoxy resin. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012052044(A) 申请公布日期 2012.03.15
申请号 JP20100196657 申请日期 2010.09.02
申请人 DIC CORP 发明人 HAYASHI HIROSHI
分类号 C08G14/12;C08G59/62;H01L23/29;H01L23/31;H05K1/03 主分类号 C08G14/12
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