发明名称 Echant and method for fabricating interconnection line and method for fabricating thin film transistor substrate using the same
摘要 Provided are an etchant, a method for fabricating a wire using the etchant, and a method for fabricating a thin film transistor (TFT) substrate using the etchant. The etchant includes a material having the formula 1, ammonium acetic acid, and the remainder of deionized water, wherein the formula 1 is expressed by: M(OH)XLY  (1) where M indicates Zn, Sn, Cr, Al, Ba, Fe, Ti, Si, or B, X indicates 2 or 3, L indicates H2O, NH3, CN, COR, or NH2R, Y indicates 0, 1, 2, or 3, and R indicates an alkyl group.
申请公布号 KR101124569(B1) 申请公布日期 2012.03.15
申请号 KR20050049453 申请日期 2005.06.09
申请人 发明人
分类号 H01L21/306;H01L21/28 主分类号 H01L21/306
代理机构 代理人
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