| 摘要 |
The method involves sawing a plate with a sawing portion (3) of a panel sawing device (2) by a linear cutting line or patterns that are provided along the linear cutting line. Completely separate plate strips are sawn, by a sawing portion (6) of the panel sawing device along another cutting line of sub-panels that are orthogonal to the linear cutting line. Partial plates are transported by a return transport device (9) of the panel sawing device to the sawing portions for performing the sawing process. |
