COMPOSITION FOR USE IN FORMING LAYER TO BE PLATED, METHOD FOR MANUFACTURING METAL PATTERN MATERIAL, AND NOVEL POLYMER

摘要

The purpose of the present invention is to provide a composition that is for use in forming a layer to be plated and that can form such a layer which is developable with an aqueous solution and exhibits excellent developability and which, even when exposed to high-temperature and high-humidity environment, exhibits high tight adhesion to a plating film (metal film) formed on a surface thereof. This composition contains a polymer which comprises at least units represented by formula (A) and units represented by formula (B).