发明名称 |
VERFAHREN ZUR HERSTELLUNG EINES LEITERRAHMENS |
摘要 |
<p>The semiconductor device mounting surface and substrate mounting surface of a metallic sheet (1) of a lead frame are plated with palladium (1a). The formed lead part, pad part, no-mounting surfaces, and side faces are not plated.</p> |
申请公布号 |
AT546835(T) |
申请公布日期 |
2012.03.15 |
申请号 |
AT20020743870T |
申请日期 |
2002.07.09 |
申请人 |
SUMITOMO METAL MINING COMPANY LIMITED |
发明人 |
IITANI, KAZUNORI;HAMADA, YOUICHIROU |
分类号 |
H01L23/50;H01L21/48;H01L23/495 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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