发明名称 HEAT DISSIPATION SHEET AND METHOD OF PRODUCING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat dissipation sheet having superior thermal conductivity and heat resistance when compared with prior art. <P>SOLUTION: Metal films 2A, 2B are laminated on one surface or both surfaces of a heat dissipation layer 1 formed by compression molding a thermally conductive resin composition containing electron beam (EB) cross-linking olefin-based resin and a thermally conductive filler, and then the heat dissipation layer 1 is cross-linked by EB irradiation to produce a heat dissipation sheet. When the heat dissipation sheet is produced, the thermally conductive resin composition is prepared and the heat dissipation layer 1 is compression molded using the thermally conductive resin composition, and then metal films 2A, 2B are laminated on one surface or both surfaces of the heat dissipation layer 1, and the heat dissipation layer 1 is cross-linked by EB irradiation. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012054314(A) 申请公布日期 2012.03.15
申请号 JP20100194027 申请日期 2010.08.31
申请人 DAINIPPON PRINTING CO LTD 发明人 YAGI IZUMI;UEKI TAKAYUKI
分类号 H01L23/36;B32B15/08;B32B27/20;B32B27/32;C08J7/00;C08L23/00;H05K7/20 主分类号 H01L23/36
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