发明名称 HEAT CONDUCTIVE SILICONE GREASE COMPOSITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat conductive silicone grease composition, having high heat conductivity and maintaining excellent fluidity, thereby giving good workability, and following a fine concavo-convex pattern, and reducing contact heat resistance, thereby showing excellent heat dissipation performance, and to improve reliability of the heat conductive silicone grease composition upon mounting, by increasing durability of the composition excellent in heat dissipation performance and workability under high temperature and high humidity conditions. <P>SOLUTION: The heat conductive silicone grease composition comprises (A) 100 parts by volume of organopolysiloxane having a specified structure and a kinetic viscosity of 10 to 10,000 mm<SP POS="POST">2</SP>/s at 25&deg;C, (B) 0.1 to 50 parts by volume of alkoxysilane having a specified substituent and (C) 100 to 2,500 parts by volume of a heat conductive filler. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012052137(A) 申请公布日期 2012.03.15
申请号 JP20110258474 申请日期 2011.11.28
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 ENDO AKIHIRO;MIYOSHI TAKASHI;YAMADA KUNIHIRO;KIZAKI HIROAKI
分类号 C10M169/02;C10M105/76;C10M107/50;C10M113/02;C10M113/06;C10M113/08;C10M113/12;C10N10/02;C10N10/04;C10N10/06;C10N20/02;C10N20/06;C10N30/00;C10N50/10 主分类号 C10M169/02
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