发明名称 PROCESS OF FORMING AN AIR GAP IN A MICROELECTROMECHANICAL SYSTEM DEVICE USING A LINER MATERIAL
摘要 This disclosure provides systems, methods and apparatus for forming an air gap in an EMS device without using a sacrificial layer in the air gap. In some implementations, a support structure is formed on the substrate, and a sacrificial substrate is provided on the support structure. A liner material is deposited on the substrate, the support structure, and the sacrificial substrate, for instance, via an atomic layer deposition (ALD) process. The sacrificial substrate can be removed, and a top layer material can be deposited on the exposed areas of the support structure and the liner material. The liner material defines an air gap between the substrate and the top layer material.
申请公布号 US2012062570(A1) 申请公布日期 2012.03.15
申请号 US201113175497 申请日期 2011.07.01
申请人 MIGNARD MARC MAURICE;QUALCOMM MEMS TECHNOLOGIES, INC. 发明人 MIGNARD MARC MAURICE
分类号 G06T1/00;B05D5/12;B32B3/10;B32B38/10 主分类号 G06T1/00
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