| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device with a current inhibition mechanism on the underside of a wire bonding pad, and a method for manufacturing the same. <P>SOLUTION: The current inhibition mechanism can make a conductive decreasing region 30 in an active region 14 of a device. The current inhibition mechanism is a damage region of a layer on which a contact 18 is formed, or a Schottky contact between an ohmic contact and the active region of the device. Otherwise, a semiconductor junction, such as a PN junction, is provided between the ohmic contact and the active region. <P>COPYRIGHT: (C)2012,JPO&INPIT |
