| 摘要 |
<p>Provided is a copper foil for a printed wiring board for which embrittlement is difficult even if the foil is laminated with an insulating substrate, a circuit formed in the copper foil by etching, and a fusing process performed on the copper-clad laminate produced by forming a Sn plating layer on the circuit. The copper foil for a printed wiring board is a copper foil for a printed wiring board on which a tin plating layer is applied to the copper surface. After Sn plating with a thickness of 0.35 µm is applied to both surfaces and both end surfaces of the copper plating with a width of 12.7 mm, the elongation (B) of the Sn plated copper foil that has undergone heat treatment at 125°C for 1 hour is 1.0% or greater.</p> |
