| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device manufacturing method that inhibits generation of voids when mounting a semiconductor chip on a wiring board with a paste adhesive interposed therebetween. <P>SOLUTION: The semiconductor device manufacturing method comprises a die-bonding step of mounting a semiconductor chip on a chip mount region 20a included in a wiring board 40 with an adhesive interposed therebetween. The wiring board 40 includes a plurality of distribution lines (first distribution lines) 23a formed on a top face of a core layer and dummy distribution lines (second distribution lines) 23d. The chip mount region 20a is disposed on a plurality of distribution lines 23a and dummy distribution line 23d. The die-bonding step includes a step of disposing the adhesive on an adhesive arrangement region on the chip mount region 20a. Each of the plurality of dummy distribution lines 23d extends along a direction in which the adhesive spreads in the die-bonding step. <P>COPYRIGHT: (C)2012,JPO&INPIT |
