| 摘要 |
<p>The purpose of the present invention is to provide an LED package manufacturing system which is capable of improving production yield by achieving uniformity of the light emission characteristics of LED packages, even when the light emission wavelength of individual LED elements varies. Element characteristics information (12), which is obtained by individually measuring in advance the light emission characteristics of a plurality of LED elements, and resin application information (14), which corresponds to the element characteristics information and an appropriate application amount of resin for obtaining LED packages having prescribed light emission characteristics, are prepared in advance. Map data (18), in which the element characteristics information (12) is associated with mounting location information (71a) that indicates the location on a substrate where the LED elements are mounted by a component mounting device (M1), is created for each substrate by a map creation processing unit (74). Completed products to which the resin has been applied are inspected by a light emission characteristics inspection device (M7), and the resin application information (14) is updated in accordance with the inspection results which are fed back to a resin application device (M4).</p> |
