| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wrapping material (laminate film) for an electronic component case not raising any trouble even if deformation amount becomes large at bulging molding or deep drawing molding, which can be manufactured with good production efficiency. <P>SOLUTION: The wrapping material for the electronic component case is formed by laminating a heat resistant resin film layer, a metal foil layer, and a not extended thermoplastic resin film layer in this sequence interposing or not interposing another layers in between. A sliding property imparting layer is formed on an outermost layer of an extended heat resistant resin film layer, and the sliding property imparting layer contains the thermoplastic resin and silicon compound with numerical average molecular weight of not less than 1,000. <P>COPYRIGHT: (C)2007,JPO&INPIT |
