Cooling device for an electric device and method for producing same

摘要

The device has a cooling element provided as a housing lid (5) of an electrical device. An electronic circuit is arranged on a printed circuit board (3). A pressing pin (4) is arranged above a power loss producing element (2) of the electronic circuit so that mechanical and thermal contacts to the board are ensured. The pressing-pin is manufactured by an injection molding process. The pressing-pin is produced as a seal (6) for a lower housing part (1) and the housing lid made of liquid-silicone. The pressing-pin is pressed with pressing force (F) of 100 to 200 Newton after a mounting step. An independent claim is also included for a method for manufacturing a cooling device for an electrical device.