| 摘要 |
<p>PURPOSE: An adhesive sheet for protecting a semiconductor wafer is provided not to generate bending of a semiconductor wafer in case of grinding of large sized wafer, to have excellent followability, not to generate floating from patterns as time passed, and to have good stress dispersibility at grinding. CONSTITUTION: An adhesive sheet for a semiconductor wafer comprises one layer formed from an acrylurethane resin without a base material layer. The stress relaxation ratio of the adhesive sheet is 40% or more at 10% elongation. The tape floating width after 24 hours at bonding the adhesive sheet at the level difference of 30 micron has the increasing rate of near 40% compared with initial value. The thickness of the adhesive sheet is 5-1000 micron. The adhesion of the both sides of the adhesive sheet are different each other.</p> |
