发明名称 AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION
摘要 The aqueous acidic solution for electrolytically depositing high polish, decorative bright, smooth and level copper coatings on large area metal or plastic parts contains a) at least one oxygen-containing, high molecular additive and b) at least one water soluble sulfur compound, wherein the solution additionally contains c) at least one aromatic halogen derivative having the general formula (I), wherein R1, R2, R3, R4, R5 and R6 are each independently radicals selected from the group comprising hydrogen, aldehyde, acetyl, hydroxy, hydroxyalkyl having 1 - 4 carbon atoms, alkyl having 1 - 4 carbon atoms and halogen, with the proviso that the number of residues R1, R2, R3, R4, R5 and R6 which are halogen ranges from 1 to 5.
申请公布号 CA2532445(C) 申请公布日期 2012.03.13
申请号 CA20042532445 申请日期 2004.07.28
申请人 ATOTECH DEUTSCHLAND GMBH 发明人 DAHMS, WOLFGANG;FELS, CARL CHRISTIAN;BAUER, GUNTHER
分类号 C25D3/38 主分类号 C25D3/38
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