发明名称 Noise-suppressing wiring-member and printed wiring board
摘要 The present invention relates to a wiring member including: a copper foil layer having a smooth surface with a surface roughness Rz of 2 μm or less; a noise suppressing layer containing a metallic material or a conductive ceramic and having a thickness of 5 to 200 nm; and an insulating resin layer provided between the smooth surface of the copper foil layer and the noise suppressing layer, and also relates to a printed wiring board equipped with the wiring member. Moreover, the present invention relates to a noise suppressing structure including: a first conductive layer; a second conductive layer; a noise suppressing layer provided between the first conductive layer and the second conductive layer, the noise suppressing layer being to be electromagnetically-coupled with the first conductive layer, the noise suppressing layer comprising a metallic material or a conductive ceramic, and the noise suppressing layer having a thickness of 5 to 300 nm; a first insulating layer provided between the first conductive layer and the noise suppressing layer; and a second insulating layer provided between the second conductive layer and the noise suppressing layer; wherein the noise suppressing structure has: a region (I) in which the noise suppressing layer and the first conductive layer face each other; and a region (II) in which the noise suppressing layer and the first conductive layer do not face each other but the noise suppressing layer and the second conductive layer face each other, the regions (I) and (II) neighboring each other.
申请公布号 US8134084(B2) 申请公布日期 2012.03.13
申请号 US20070769386 申请日期 2007.06.27
申请人 KAWAGUCHI TOSHIYUKI;TAHARA KAZUTOKI;SAGA TSUTOMU;NEGISHI MITSUAKI;SHIN-ETSU POLYMER CO., LTD. 发明人 KAWAGUCHI TOSHIYUKI;TAHARA KAZUTOKI;SAGA TSUTOMU;NEGISHI MITSUAKI
分类号 H05K1/11 主分类号 H05K1/11
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