METHOD FOR DETECTING EDGES OF WAFER

摘要

PURPOSE: A wafer edge detection method is provided to accurately detect edges of a wafer using an image binary-coding method, thereby easily performing a manufacturing process on the central part of the wafer. CONSTITUTION: An image with respect to a region(A) which includes an edge of a wafer is binary-coded. The edge(a) of the wafer is detected from the binary-coded image. The image which includes the edge of the wafer is a mono image. Three or more edges of the wafer are detected through the binary-coding process of the mono image. The wafer is attached on a tape.