发明名称 Test mode for multi-chip integrated circuit packages
摘要 When a test mode of a controller of a multi-chip integrated circuit package is activated, external signal lines coupled to the controller are re-mapped to signal lines of one of the integrated circuit devices of the multi-chip integrated circuit package to permit direct testing of the integrated circuit device.
申请公布号 US8136000(B2) 申请公布日期 2012.03.13
申请号 US20100885781 申请日期 2010.09.20
申请人 PEKNY THEODORE T.;MICRON TECHNOLOGY, INC. 发明人 PEKNY THEODORE T.
分类号 G11C29/00 主分类号 G11C29/00
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