LEADFRAME AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A lead frame and a manufacturing method thereof are provided to control an etching depth by performing a lower etching process after performing a molding process. CONSTITUTION: A plurality of lead parts(100) electrically connects a device chip(120) and an external circuit. An inner lead(122) is arranged on a first surface of the lead part. An outer lead(100b) is arranged on a second surface of the lead part. The device chip is connected to the inner lead of the lead part through a wire(126). An etching part(112) insulates neighboring lead parts. An encapsulating material(130) simultaneously seals a lead frame(200) and the device chip.