STACKING METHOD OF WAFER USING FILLING-METAL PROJECTED OUT OF THE THROUGH VIA HOLE

摘要

PURPOSE: A stacking method of wafer using filling-metal projected through a via hole is provided to improve productivity by forming a wafer protrusion through only filing a filling material into a penetration via hole and simplifying wafer lamination process. CONSTITUTION: A wafer having a through via hole is mounted in a via hole filling apparatus(S10). A filling metal fused inside the through via hole is filled(S20). Chemical mechanical polishing on one side of a wafer is performed(S30). Silicon etching on one side of the wafer is performed(S40). A protrusion is formed in the area corresponding to the through via hole(S50). The protrusion is touched with the filling metal which is filled in the through via hole of the wafer(S60). Under fill is coated between the wafers(S70).