| 摘要 |
PURPOSE: An optical device package and a manufacturing method thereof are provided to reduce a thickness of an optical device package by forming a cavity on a metal substrate and mounting an optical device. CONSTITUTION: A metal substrate(110) forms one or more cavities(120). An insulating layer(130) is formed on an upper side of the metal substrate including the cavity. An optical device(160) is accepted to the cavity. A circuit pattern layer(140) is formed on the upper side of the metal substrate on which the cavity is not formed. A connection part(170) electrically connects the optical device and the circuit pattern layer. |
