发明名称 SPRING LOAD ADJUSTMENT STRUCTURE AND SPRING LOAD ADJUSTMENT METHOD OF CONTACT DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a spring load adjustment structure and a spring load adjustment method of a contact device which suppress an increase in the number of components while preventing an increase in the size of the contact device and which also suppress an increase in manufacturing costs. <P>SOLUTION: A spring load adjustment structure of a contact device comprises: fixed terminals 33 each having a fixed contact 32; a movable contact piece 35 which has, on its upper face, movable contacts 34 making contact with and separating from the respective fixed contacts 32, and which has an insertion hole 35a formed thereon; a pressing spring 36 which has an upper end making contact with a lower face of the movable contact piece 35, and which expands and contracts in the vertical direction; a movable shaft 66 which is movably inserted into the insertion hole 35a and has a flange part 64 formed thereon; a sandwiching member 65 into which the movable shaft 66 is movably inserted, and sandwiches, together with the flange part 64, the pressing spring 36 and the movable contact piece 35; and driving means 2 which drives the movable shaft 66. A distance between the flange part 64 and the sandwiching member 65 is changed by moving the sandwiching member 65 in the vertical direction, and the sandwiching member 65 is fixed onto the movable shaft 66 at a position where a contact pressure of the pressing spring 36 against the movable contact piece 35 becomes a preset value. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012048908(A) 申请公布日期 2012.03.08
申请号 JP20100188629 申请日期 2010.08.25
申请人 PANASONIC ELECTRIC WORKS CO LTD 发明人 ENOMOTO HIDEKI;YAMAMOTO RITSU;FUKUDA SUMIHISA;IKEDA YOJI;OZAKI RYOSUKE
分类号 H01H50/00;H01H49/00;H01H50/20;H01H50/54 主分类号 H01H50/00
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