| 摘要 |
The wiring substrate according to an embodiment of the present invention comprises: an inorganic insulating layer having via holes, which are through holes, formed therein; and via conductors, which are through conductors, formed in the via holes. The inorganic insulating layer includes mutually connected first inorganic insulating particles, and second inorganic insulating particles having greater particle diameters than the first inorganic insulating particles, the second inorganic insulating particles being connected together by the first inorganic insulating particles. The inner walls of the via holes (V) have convexities that include at least part of the second inorganic insulating particles, and the convexities are covered by the via conductors.
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