发明名称 ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component capable of suppressing occurrence of a warp in a laminate. <P>SOLUTION: External electrodes 14a and 14b and external electrodes 14c and 14d are installed on a lower face S2 of the laminate 12 and are connected to both ends of a main line ML and a sub line SL respectively. A warp prevention conductor 26 is arranged in an insulator layer 16 arranged on an upper face S1-side of the laminate 12 rather than an insulator layer 16 where the main line ML is arranged and an insulator layer 16 where the sub line SL is arranged. The warp prevention conductor 26 is overlapped with the external electrodes 14 when it is viewed in a plan view from a z-axis direction. A conductor layer which is not connected to the main line ML or the sub line SL is not arranged in the insulator layer 16 arranged on a lower face S2-side of the laminate 12 rather than the insulator layer 16 where the warp prevention conductor 26 is arranged. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012049694(A) 申请公布日期 2012.03.08
申请号 JP20100188363 申请日期 2010.08.25
申请人 MURATA MFG CO LTD 发明人 MASUDA HIROSHI;MORI TAKAHIRO
分类号 H01P5/18;H01P11/00 主分类号 H01P5/18
代理机构 代理人
主权项
地址