PANEL CUTTING DEVICE AND PANEL CUTTING METHOD USING THE SAME

摘要

PURPOSE: A panel cutting device and a panel cutting method using the same are provided to scribe a substrate without damages to cut the substrate. CONSTITUTION: A first conveyor(100) and a second conveyor(120) are arranged at an interval in a first direction which is a direction for transferring a substrate on an installation stand. A scribe unit(140) is arranged between the first conveyor and the second conveyor. A substrate grabbing device(160) is installed in the first conveyor of the installation stand. The substrate grabbing device grabs at least one edge of the substrate when the substrate is scribed.