LIGHT-EMITTING DEVICE, CIRCUIT BOARD, PACKAGE ARRAY FOR LIGHT-EMITTING DEVICE, AND METHOD FOR PRODUCING PACKAGE ARRAY FOR LIGHT-EMITTING DEVICE

摘要

A light-emitting device (100) includes a light-emitting element (10) and a package (20). The package (20) is made up of a molded body (30) and a lead (40) embedded in the molded body (30). The lead (40) includes a mounting section (41) on which the light-emitting element (10) is mounted, a terminal section (42) connected to the mounting section (41), and an exposure section (43). The package (20) has a front surface (20C) which is the light exit surface, a rear surface (20D1) in opposition to the front surface (20C), and a bottom surface (20A) contiguous to the front surface (20C) and the rear surface (20D1). The light-emitting element (10) is mounted on the front surface side of the mounting section (41). The exposure section (43) is connected to the rear surface side of the mounting section (41) and is exposed from the molded body at the bottom surface (20A) and the rear surface (20D1). The terminal section (42) is exposed from the molded body (30) at the bottom surface (20A).