THE RADIANT HEAT CIRCUIT BOARD AND THE METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A heat dissipation circuit board and a manufacturing method thereof are provided to form a heat pass in an insulating layer by aligning an oxide magnetic substance formed into inorganic filler to a specified direction. CONSTITUTION: A heat dissipation circuit board(100) comprises a metal plate(110), an insulating layer(120) formed on a metal plate, and a circuit pattern(140) formed on the insulating layer. The metal plate can be either of copper, aluminum, nickel, or alloy including gold or platinum having high heat conduction. The insulating layer serves as a bonding layer which electrically insulates a metal plate on a lower part and a circuit pattern on an upper part. Inorganic filler(130) is formed into a magnetic material having magnetism. The inorganic filler is regularly aligned in the insulating layer along a direction of a magnetic force to form a heat pass. The circuit pattern is laminated on the insulating layer.