发明名称 IMPROVED METAL FRAME FOR ELECTRONIC HARDWARE AND FLAT PANEL DISPLAY
摘要 <P>PROBLEM TO BE SOLVED: To provide a metal frame for electronic hardware having improved physical mechanical properties including an elastic limit and preferably to provide a highly processable metal frame wherein at least a portion of the frame is made of either a Zr/Ti or Fe-based bulk-solidifying amorphous alloys and bulk-solidifying amorphous alloy-composites, and a method for manufacturing the same. <P>SOLUTION: The metal frame for electronic hardware includes a body having walls defining at least one enclosure wherein the enclosure is designed to at least partially encase at least one electronic component, wherein at least a portion of the body is formed from a bulk-solidifying amorphous alloy material, and wherein the bulk-solidifying amorphous alloy material has an elastic limit of about 1.5% or greater. The bulk-solidifying amorphous alloy is described by the molecular formula: (Zr,Ti)a(Ni,Cu,Fe)b(Be,Al,Si,B)c, wherein "a" is in the range of from about 30 to 75, "b" is in the range of from about 5 to 60, and "c" is in the range of from about 0 to 50 in atomic percentages. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012046826(A) 申请公布日期 2012.03.08
申请号 JP20110219558 申请日期 2011.10.03
申请人 LIQUIDMETAL TECHNOLOGIES INC 发明人 PEKER ATAKAN;JOHNSON WILLIAM L
分类号 B22D11/00;C22C45/10;A47B81/00;B22D17/00;C21D6/00;C22C1/00;C22C14/00;C22C16/00;C22C27/04;C22C29/02;C22C32/00;C22C33/00;C22C33/04;C22C45/00;C22C45/02;C22C45/04;C22C45/06;C22C49/02;C22F1/00;H05K5/00;H05K5/02;H05K5/04 主分类号 B22D11/00
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