PURPOSE: A dicing method of a semiconductor wafer is provided to manufacture chips having various types or shapes by controlling a lateral profile of the chips with the change of a process condition in dry etching. CONSTITUTION: A semiconductor wafer(10) is etched by using a scribe lane mask pattern(14) as a mask. Chip support parts(18) are formed on a lower part of a chip(12). The scribe lane mask pattern is removed. A back side of the semiconductor wafer is grinded. Separated individual chips and individual chip supporting parts are formed.
