Gold-plating electrolyte and method of preparing it

摘要

The gold-plating electrolyte has the following composition (in g/l): Hexapotassium mu -ethylenediaminetetraacetatobis (gold sulphite(I)) 10.5-210 Alkali metal salts of ethylenediaminetetraacetic acid 17.8-140 Optionally, ethylenediaminetetraacetatocopper(II) bis(2-aminoethylammonium) 0.01-15 Optionally ethylenediaminetetraacetatocadmium bis(2-aminoethylammonium) 0.01-15 Distilled water remainder The electrolyte may also contain additives such as ethylenediaminetetraacetatocopper(II)bis(2-aminoethylammonium) or ethylenediaminetetraacetatocadmiumbis(2-aminoethylammonium) in an amount of 0.01 to 15 g/l. This invention may be applied in the electronic industry, watch industry, jewellery industry and in radio engineering.