Connection device for a semiconductor module

摘要

The device (10) has a housing with a circuit substrate and a pressure body for pressure contacting of a terminal element. The terminal element is designed as a contact spring (18) with a spring portion between contact parts (38). The housing is associated with a spring shaft body (12), and the pressure body is associated with another spring shaft body (14), where the shaft bodies are axially aligned to a spring shaft (16) and axially movable with one another, where the contact spring is captively provided in the spring shaft.