发明名称 |
PHOSPHOR FILM, METHOD OF MANUFACTURING THE SAME, METHOD OF COATING PHOSPHOR LAYER ON AN LED CHIP, METHOD OF MANUFACTURING LED PACKAGE AND LED PACKAGE MANUFACTURED THEREOF |
摘要 |
<p>PURPOSE: A phosphor film, a manufacturing method thereof, a method for coating a phosphor layer, a method for manufacturing an LED package, and an LED package manufactured thereby are provided to prevent a wire from being deformed even if the wire is coated on a wire-bonded light emitting diode chip. CONSTITUTION: A phosphor film(100) comprises a base film(110), a phosphor layer(130), and a cover film(150). The phosphor layer is formed on the base film and mixes a phosphor particle with a resinous material hardened partially. The cover film is formed in order to protect the phosphor layer on the phosphor layer. The phosphor layer is in a semi-hardening state at room temperature. A variable phase change is generated when the phosphor layer is heated.</p> |
申请公布号 |
KR20120019385(A) |
申请公布日期 |
2012.03.06 |
申请号 |
KR20110083886 |
申请日期 |
2011.08.23 |
申请人 |
SAMSUNG LED CO., LTD. |
发明人 |
KWAK, CHANG HOON;PARK, IL WOO;LEE, KYU JIN;YOO, CHEOL JUN;HONG, SEONG JAE |
分类号 |
G02B5/23;H01L33/50 |
主分类号 |
G02B5/23 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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