CONTROLLER FOR BONDING APPARATUS AND MULTILAYER BONDING METHOD

摘要

Disclosed is a multi-layer bonding method which is provided with: a step of manufacturing a first bonded substrate by bonding together an upper substrate and an intermediate substrate therefor inside of a bonding chamber; a step of carrying a lower substrate for the first bonded substrate into the bonding chamber when the first bonded substrate is disposed inside of the bonding chamber; and a step of manufacturing a second bonded substrate by bonding together the first bonded substrate and the lower substrate therefor inside of the bonding chamber. In the multi-layer bonding method, the upper substrate can be bonded to the lower substrate without being taken out from the bonding chamber after the upper substrate is bonded to the intermediate substrate. Therefore, the second bonded substrate can be manufactured at a high speed and low cost.