LASER LIFT-OFF METHOD AND LASER LIFT-OFF APPARATUS

摘要

PURPOSE: A laser lift-off method and a laser lift-off apparatus are provided to easily separate a thin film electronic device from a substrate by removing a sacrificial layer with a laser beam. CONSTITUTION: A sacrificial layer(200) is formed on a substrate(100). An adhesive layer(300) is formed on the sacrificial layer. A flexible substrate(400) is laminated on the adhesive layer. A thin film electronic device(500) is formed on the flexible substrate. A laser beam is irradiated to the sacrificial layer to separate the thin film electronic device from the substrate.