| 发明名称 |
STACKED-CHIP PACKAGES IN PACKAGE-ON-PACKAGE APPARATUS, METHODS OF ASSEMBLING SAME, AND SYSTEMS CONTAINING SAME |
| 摘要 |
A stacked-chip apparatus includes a package substrate and an interposer with a chip stack disposed with a standoff that matches the interposer. A package-on-package stacked-chip apparatus includes a top package disposed on the interposer. |
| 申请公布号 |
KR20120018807(A) |
申请公布日期 |
2012.03.05 |
| 申请号 |
KR20117030885 |
申请日期 |
2010.05.04 |
| 申请人 |
INTEL CORPORATION |
发明人 |
MUTHUKUMAR SRIRAM;GEALER CHARLES A. |
| 分类号 |
H01L23/12;H01L23/48 |
主分类号 |
H01L23/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
