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发明名称
感测式半导体封装件及其制法
摘要
一种感测式半导体封装件及其制法,主要系提供一基板,并于该基板接置具有感测区之感测晶片,且以焊线电性连接该感测晶片与该基板,同时于一透光体上形成有黏着层,其中该黏着层具有对应该感测区之开口,以将该透光体藉由该黏着层接置于该基板上且进行加热,使该黏着层在接着于该基板时呈熔融状态而包覆感测晶片周缘及焊线,并且外露该感测区,使该透光体封盖该感测区,以形成无拦坝结构且轻薄短小的感测式半导体封装件,藉以降低制程成本,另外,透过该黏着层包覆焊线,可避免焊线断裂问题,进而增加产品可靠度。
申请公布号
TWI359481
申请公布日期
2012.03.01
申请号
TW096150714
申请日期
2007.12.28
申请人
矽品精密工业股份有限公司 台中市潭子区大丰路3段123号
发明人
张泽文;詹长岳;张锦煌;黄致明
分类号
H01L23/28;H01L27/14
主分类号
H01L23/28
代理机构
代理人
陈昭诚 台北市中正区博爱路35号9楼
主权项
地址
台中市潭子区大丰路3段123号
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