| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor wafer dicing method which prevents scattering of small pieces on a peripheral part of a semiconductor wafer without decreasing the number of semiconductor chips cut from the semiconductor wafer. <P>SOLUTION: The semiconductor wafer dicing method comprises a step (1) of dicing a semiconductor wafer 10 along a plurality of dicing lines parallel to a first linear direction, and a step (2) of subsequently dicing the semiconductor wafer 10 along a plurality of dicing lines parallel to a second linear direction. The step (2) is the step of performing a step of starting dicing from one side end of the semiconductor wafer 10 along any one dicing line and discontinuing the dicing before reaching another side end, and a step of starting dicing from the other side end of the semiconductor wafer 10 along the any one dicing line to a previously cut portion of the semiconductor wafer 10, along all the dicing lines parallel to the second linear direction. <P>COPYRIGHT: (C)2012,JPO&INPIT |
