发明名称 APPARATUS AND METHOD FOR MANUFACTURING A SWING-RING PLATE
摘要 The present invention relates to an apparatus and method for manufacturing a swing-ring plate, and more particularly, to an apparatus for manufacturing a swing ring, comprising: a bending mechanism that moves a linear plate cut to a certain length from one end to the other, and bends the linear plate at either end thereof so as to bring the cross-sections thereof together and opposite one another in order to form a ring; a pre-bonding mechanism that fixes the bent plate in the ring shape and pre-bonds the ends in the horizontal and vertical directions; and a final bonding mechanism that completely bonds the pre-bonded part of the plate by revolving around the fixed pre-bonded plate and positioning so that the top and bottom surfaces of the pre-bonded plate face upward. According to the present invention, due to the fact that the swing-ring plate can be manufactured by bending a single plate, the traditional task of adjusting the smoothness of each part can be reduced, reducing work time and costs, and particularly, due to the lack of wasting raw materials, as occurs in the traditional processing of a unit plate that carries a certain curvature from a limited area, manufacturing costs can be further reduced, and smoothness can be readily adjusted to improve product reliability.
申请公布号 WO2012026677(A2) 申请公布日期 2012.03.01
申请号 WO2011KR04727 申请日期 2011.06.29
申请人 HANARO TECH CO., LTD.;LEE, SI HWA 发明人 LEE, SI HWA
分类号 B21D53/16;B21C51/00;B21D5/00;B23K31/02 主分类号 B21D53/16
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