发明名称 MANUFACTURE OF MULTILAYER PRINTED CIRCUIT BOARD
摘要 PURPOSE:To perform correctly directing electrical connection between respective wiring layers even though a laminating process is affected by heat or moisture, by performing positioning in each through-hole prior to lamination of layers and performing its lamination while piercing a pin for position-fixing so the the above positioning does not move. CONSTITUTION:Prior to lamination of layers, respective through-holes are formed in each internal layer plate 1 and when laminated, a pin 5 for position- fixing is inserted in the through hole 4 of the internal layer plate 1, corresponding to an intermediate layer of a substrate out of respective internal layer plates 1 and it is fixed after bonding it in a state that both end parts of the pin protrude satisfactorily from each internal layer plate 1. Then prepregs 3 are inserted in respective internal layer plates 1 and a protruding part of the foregoing pin 5 is inserted in the through hole-4 of other internal layer plate 1 which is adjacent to the initial through-hole and after that, positioning is carried out among the through-holes mutually and electrical continuity is obtained respective wiring layers 2 and in this way, a plurality of internal layer plates are fixed by laminating and pressing them with pressure.
申请公布号 JPH01112797(A) 申请公布日期 1989.05.01
申请号 JP19870270991 申请日期 1987.10.27
申请人 MITSUBISHI ELECTRIC CORP 发明人 KIMATA HIROYUKI
分类号 H05K3/46 主分类号 H05K3/46
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