发明名称 LEAD FRAME FOR MANUFACTURING ELECTRONIC COMPONENT, AND MANUFACTURING METHOD FOR ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for improving defects caused due to distortion of a lead frame or the like, and protecting three-dimensional structure of the lead frame when rewinding the three-dimensionally assembled lead frame. <P>SOLUTION: In a lead frame for mounting an electric element, the lead frame is provided with a protector, and the size of the protector in a vertical direction is larger than the size in the vertical direction of the electric element mounted on the lead frame. The protector is integrated with the lead frame and is removed when cutting off the lead frame. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012044215(A) 申请公布日期 2012.03.01
申请号 JP20110248562 申请日期 2011.11.14
申请人 SANYO ELECTRIC CO LTD 发明人 MATSUOKA KEIKO;UMEDA MASASHI
分类号 H01L23/48;H01G9/15 主分类号 H01L23/48
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