发明名称 |
LIGHT EMITTING COMPONENT, LIGHT EMITTING UNIT, METHOD FOR MANUFACTURING LIGHT EMITTING COMPONENT, AND METHOD FOR BODING SEALING RESIN |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting component which improves the adhesiveness of a sealing resin without changing material composition while maintaining the light resistance of the sealing resin and a gas shut off function of a primer layer, and to provide a method for manufacturing the light emitting component. <P>SOLUTION: A light emitting element and a primer layer having a high gas shut off capability are sealed by a sealing resin which is excellent in light resistance. Further, irregular structure is formed on the primer layer. These features utilize anchor effect and improve the adhesiveness between the sealing resin and the package substrate without changing material composition. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012044104(A) |
申请公布日期 |
2012.03.01 |
申请号 |
JP20100186311 |
申请日期 |
2010.08.23 |
申请人 |
SEIKO INSTRUMENTS INC |
发明人 |
NAKAYAMA HITOSHI;NAKAMURA NORIHIKO;ARAOGI MASATAKA |
分类号 |
H01L33/54;H01L33/56 |
主分类号 |
H01L33/54 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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